Method for manufacturing magnetic memory chip device

ABSTRACT

A method for manufacturing a magnetic memory chip device comprises the steps of: writing information in each of a plurality of magnetic memory chips formed on a silicon wafer; adhering a high magnetic permeability plate on a back face of the silicon wafer after writing information, the high magnetic permeability plate having a higher magnetic permeability than silicon and having a thickness of 50 um or more; dicing the silicon wafer into respective magnetic memory chips after adhering the high magnetic permeability plate.

RELATED APPLICATIONS

This application is a Divisional of U.S. application Ser. No.12/525,999, filed on Aug. 5, 2009, which is the U.S. National Phaseunder 35 U.S.C. §371 of International Application No. PCT/JP2008/052976,filed on Feb. 21, 2008, which in turn claims the benefit of JapaneseApplication No. 2007-047822, filed on Feb. 27, 2007, the disclosures ofwhich Applications are incorporated by reference herein.

TECHNICAL FIELD

The present invention relates to a method for manufacturing a magneticmemory chip device that can protect a magnetic memory chip from anexternal magnetic field in assembly steps.

BACKGROUND ART

A MRAM (Magnetic Random Access Memory) is a magnetic memory chip using amagnetoresistive effect on the basis of a spin depending conductionphenomenon characteristic of a nanomagnet, and a nonvolatile memory thatcan hold memories without supplying electric power from the exterior.However, the MRAM is susceptible to an external magnetic field, and if asingle chip is subjected to a magnetic field of 10 [Oe] or higher, thereis a possibility of malfunction, such as erroneous writing. Therefore,in a magnetic memory chip device incorporating the MRAM, techniquesproviding a magnetic shield that protects the MRAM from the externalmagnetic field have been proposed (for example, refer to PatentDocuments 1 to 9).

-   Patent Document 1: JP-A-2003-115578-   Patent Document 2: JP-A-2004-47656-   Patent Document 3: JP-A-2004-103071-   Patent Document 4: JP-A-2004-193247-   Patent Document 5: JP-A-2004-200185-   Patent Document 6: JP-A-2004-207322-   Patent Document 7: JP-A-2004-221288-   Patent Document 8: JP-A-2004-221463-   Patent Document 9: JP-A-2005-158985

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention

Conventional magnetic memory chip device can protect the MRAM, from theexternal magnetic field in the state wherein the device is completed.However, in the step of assembling the device, there has been a problemwherein the MRAM is affected by the external magnetic field generated bymanufacturing equipment, such as a die-bonding machine and awire-bonding machine, which uses motors. Therefore, it has beennecessary to introduce special manufacturing equipment without theeffect of magnetic field on the MRAM.

The present invention has been made to solve problems as describedabove, and an object thereof is to obtain a method for manufacturing amagnetic memory chip device that can protect a magnetic memory chip froman external magnetic field in assembly steps.

Means for Solving the Problems

A method for manufacturing a magnetic memory chip device comprises thesteps of: writing information in each of a plurality of magnetic memorychips formed on a silicon wafer; adhering a high magnetic permeabilityplate on a back face of the silicon wafer after writing information, thehigh magnetic permeability plate having a higher magnetic permeabilitythan silicon and having a thickness of 50 um or more; dicing the siliconwafer into respective magnetic memory chips after adhering the highmagnetic permeability plate.

Effect of the Invention

According to the embodiments, a magnetic memory chip can be protectedfrom an external magnetic field in assembly steps. Thereby, even in thecase using ordinary manufacturing equipment, the magnetic memory chipcan be protected from the external magnetic field generated by themanufacturing equipment. Therefore, there is an advantage that change inthe assembly line is not required.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 Flow chart shows a method for manufacturing a magnetic memorychip device according to the first embodiment of the present invention.

FIG. 2 Perspective view shows a process for manufacturing a magneticmemory chip device according to the first embodiment of the presentinvention.

FIG. 3 Perspective view shows the standard MRAM.

FIG. 4 Circuit diagram shows the standard MRAM.

FIG. 5 Perspective view shows a process for manufacturing a magneticmemory chip device according to the first embodiment of the presentinvention.

FIG. 6 Perspective view shows a process for manufacturing a magneticmemory chip device according to the first embodiment of the presentinvention.

FIG. 7 Perspective view shows a process for manufacturing a magneticmemory chip device according to the first embodiment of the presentinvention.

FIG. 8 Perspective view shows a process for manufacturing a magneticmemory chip device according to the first embodiment of the presentinvention.

FIG. 9 Perspective view shows a process for manufacturing a magneticmemory chip device according to the first embodiment of the presentinvention.

FIG. 10 Perspective view shows a process for manufacturing a magneticmemory chip device according to the first embodiment of the presentinvention.

FIG. 11 Perspective view shows a process for manufacturing a magneticmemory chip device according to the first embodiment of the presentinvention.

FIG. 12 Sectional view shows a process for manufacturing a magneticmemory chip device according to the first embodiment of the presentinvention.

FIG. 13 Sectional view shows a process for manufacturing a magneticmemory chip device according to the first embodiment of the presentinvention.

FIG. 14 Sectional view shows a process for manufacturing a magneticmemory chip device according to the first embodiment of the presentinvention.

FIG. 15 Sectional view shows another example of a magnetic memory chipdevice according to the first embodiment of the present invention.

FIG. 16 Flow chart shows a process for manufacturing a magnetic memorychip device according to the second embodiment of the present invention.

FIG. 17 Perspective view shows a process for manufacturing a magneticmemory chip device according to the second embodiment of the presentinvention.

FIG. 18 Perspective view shows a process for manufacturing a magneticmemory chip device according to the second embodiment of the presentinvention.

FIG. 19 Perspective view shows a process for manufacturing a magneticmemory chip device according to the second embodiment of the presentinvention.

FIG. 20 Perspective view shows a process for manufacturing a magneticmemory chip device according to the second embodiment of the presentinvention.

FIG. 21 Flow chart shows a process for manufacturing a magnetic memorychip device according to the third embodiment of the present invention.

FIG. 22 Perspective view shows a process for manufacturing a magneticmemory chip device according to the third embodiment of the presentinvention.

FIG. 23 Perspective view shows a process for manufacturing a magneticmemory chip device according to the third embodiment of the presentinvention.

DESCRIPTION OF REFERENCE NUMERALS

-   11 wafer (silicon wafer)-   12 MRAM chip (magnetic memory chip)-   15 die attach film-   16 NiFe plate (high magnetic permeability plate)-   17, 31 die attach film (adhesive layer)-   21 die pad (lead frame)-   26 wiring substrate

BEST MODE FOR CARRYING OUT THE INVENTION First Embodiment

A method for manufacturing a magnetic memory chip device according tothe first embodiment of the present invention will be describedreferring to the flow chart shown in FIG. 1. First, as shown in FIG. 2,a plurality of MRAM chips (magnetic memory chip) 12 are formed on awafer 11 composed of silicon (silicon wafer) (Step S1). As a basicstructure, the MRAM chips are equipped with magnetic tunnel junctionstructures wherein extremely thin tunnel insulating layers are providedbetween a pin layer and a free layer composed of magnetic films. Such amagnetic tunnel junction structure is generally referred to as TMR(Tunneling Magneto Resistance) or MTJ (Magnetic Tunnel Junction).

The direction of magnetization in the pin layer is fixed to a constantdirection. On the other hand, the direction of magnetization in the freelayer can be controlled from the exterior. When the direction ofmagnetization in the pin layer and the direction of magnetization in thefree layer are in the same direction, i.e. in the parallel state, theresistance value of the current flowing in the laminating direction ofthe magnetic memory element is lowered. On the contrary, when thedirection of magnetization in the pin layer and the direction ofmagnetization in the free layer are in the opposite direction, i.e. inthe anti-parallel state, the resistance value of the current flowing inthe laminating direction of the magnetic memory element is elevated.Therefore, by correlating the parallel state or the anti-parallel stateof the direction of magnetization with binary “0” or “1” and readingchange in the resistance value, the element can be operated as a memoryelement in the same manner as a conventional RAM.

The MRAM chip can be classified into several types according todifference in the mechanism to control the direction of magnetization ofthe free layer. When the joint surface of the magnetic tunnel junctionstructure is defined as the XY plane and the direction perpendicular tothe joint surface is defined as the Z-direction, by arranging a firstline along the X-direction and a second line along the Y-direction inthe vicinity of the magnetic tunnel junction structure, andindependently controlling the direction of current in the first line andthe second line, the direction of magnetization of the free layer can becontrolled. Here, the magnetic memory element having such a mechanism isreferred to as the standard MRAM.

Concerning the structure of the element, the standard MRAM requires twocurrent lines in the vicinity of the magnetic tunnel junction as shownin FIGS. 3 and 4. Referring to FIG. 3, the magnetic tunnel junction TMRis typically configured by laminating a pin layer MP composed of amagnetic film, an extremely thin tunnel insulating layer MT, and a freelayer MF composed of a magnetic film, in this order. The magnetic tunneljunction TMR has an anisotropic planar shape such as an ellipse, and thelengthwise direction becomes an easily magnetized axis. Here, the jointsurface of the magnetic tunnel junction TMR is defined as the XY plane,and the direction perpendicular to the joint surface is defined as theZ-direction.

A bit line BL is located along the Y-direction so as to pass the uppervicinity of the magnetic tunnel junction TMR, and is electricallyconnected to the free layer MF. A digit line DL is located along theX-direction so as to pass the lower vicinity of the magnetic tunneljunction TMR. A strap ST is a wiring routed from the pin layer MP of themagnetic tunnel junction TMR in Y-direction so as to bypass the digitline DL.

Below the magnetic tunnel junction TMR, a transistor TR including adrain region DR, a gate electrode TG, and a source region SC is located.The drain region DR is electrically connected to the strap ST by wiringsin the Z-direction, such as the pad PD and the interlayer wiring LT. Thesource region SC is electrically connected to the read line LR extendingin the X-direction. The gate electrode TG also extends in theX-direction.

Next, the operation of a standard MRAM will be described. Firstly in thecase of writing operation, when a current flows to the bit line BL inthe Y-direction, and a current flows to the digit line DL in theX-direction, the synthetic magnetic field produced by both currents isapplied to the magnetic tunnel junction TMR, and the direction ofmagnetization of the free layer MF is agreed to the direction of thesynthetic magnetic field. Then, when a current becomes zero, thedirection of magnetization of the free layer MF agrees to the firstdirection along the lengthwise direction of the plane shape.

On the other hand, when a current flows to the bit line BL in the−Y-direction, and a current flows to the digit line DL in theX-direction, a synthetic magnetic field is generated in the directionperpendicular to the above-described synthetic magnetic field, and thedirection of magnetization of the free layer MF is agreed to thedirection of the synthetic magnetic field. Then, when a current becomeszero, the direction of magnetization of the free layer MF agrees to thesecond direction opposite to the first direction.

By thus controlling the direction of current in the bit line BL at thesame time of allowing current to flow in the digit line DL, thedirection of magnetization of the free layer MF can be controlled to thefirst direction or the second direction, and the binary state of “0” or“1” can be stored. Thereafter, even in the state of no conduction, thedirection of magnetization of the free layer MF can be maintained. Asdescribed, in the case of the MRAM of a system wherein the direction ofmagnetization of the free layer MF is rewritten by wiring thecurrent-induced magnetic field, if the switching magnetic field isdecreased for lowering the power consumption of the memory cell, aproblem wherein the disturbance resistance to the disturbance magneticfield is lowered, is caused.

Next, in the case of reading operation, the digit line DL is notinvolved, and by supplying current via the route from the bit line BLthrough the magnetic tunnel junction TMR, the strap ST, the pad PD, theinterlayer wiring LT and the transistor TR to the read line LR, andchange in the resistance value of the magnetic tunnel junction TMR isdetected using a sense amplifier (not shown). If the direction ofmagnetization of the free layer MF is in parallel to the direction ofmagnetization of the pin layer MP, the resistance value is lowered; andif the direction is anti-parallel to the direction of magnetization ofthe pin layer MP, the resistance value is elevated. Therefore, thebinary state of the free layer MF is reflected by the size of theresistance value; and is read out to the exterior.

By arraying a large number of such MRAMs in a matrix, a non-volatilememory having a large capacity can be realized. In this case, since thebit line BL, the digit line DL, and the read line LR are shared, byintervening the transistor TR, matrix scanning can be realized by thegate electrode TG and the bit line BL.

The configuration of the memory cell of the MRAM is not limited to thestandard MRAM type, but the present invention can be appropriatelyapplied to the MRAM of the type using a spin implanted magnetizationreversal.

Subsequently to the step for forming a plurality of MRAM chips on thewafer 11 (Step S1), magnetic field annealing is performed on the wafer11 in a magnetic field for 4 hours at 275° C. to reset the MRAM chip 12(Step S2).

Next, as shown in FIG. 5, a probe 13 is used to perform a probe test onindividual MRAM chip 12 (Step S3). In the MRAM chip 12 determined asgood by the probe test, programs and rescue information are written(Step S4). Then, as shown in FIG. 6, the wafer 11 is subjected to backgrinding by a grinder 14 from the back face (Step S5).

Next, as shown in FIG. 7, the wafer 11 is adhered to the die attach film15. As shown in FIG. 8, the die attach film 15 is cut along theperiphery of the wafer 11. Then, as shown in FIG. 9, an NiFe plate (highmagnetic permeability plate) 16 having a thickness of 100 μm is adheredon the back face of the wafer 11 via a die attach film 15 (Step S6). Thedie attach film 15 is cured by heating at 150° C.

Next, as shown in FIG. 10, a die attach film 17 (adhesive layer) isadhered to the laminated wafer 11 and the NiFe plate 16. Then, as shownin FIG. 11, a wafer 11 is diced into respective MRAM chips 12 using adicing blade 18 (Step S7). Thereafter, cleaning is performed.

Next, as shown in FIG. 12, each MRAM chip 12 is die-bonded onto a diepad 21 via a die attach film 17 (Step S8). The die attach film 17 iscured by heating to 150° C. The MRAM chip 12 is wire-bonded to externalleads 22 using gold wires 23 (Step S9). Then, as shown in FIG. 13, theMRAM chip 12 and the gold wires 23 are resin-molded by a resin 24 (StepS10).

Next, as shown in FIG. 14, an Ni/Pd/Au laminated plating film 25 isformed on the surface of the external leads 22 composed of Cu byelectric-field plating (Step S11). The external leads 22 are alsomolded. Finally, the test for the manufactured magnetic memory chipdevice is conducted (Step S12).

As described above, in the first embodiment, an NiFe plate 16 formed ofa substance having a higher magnetic permeability than silicon isadhered to the back face of the wafer 11 in the middle of the assemblystep. Thereby, the magnetic field line from the exterior passes mainlythrough the NiFe plate 16, and can reduce the quantity of the magneticfield line passing through the MRAM chip 12 composed of silicon.Therefore, in the subsequent assembly step, the MRAM chip 12 can beprotected from external magnetic field. Specifically, the MRAM chip 12can be protected from external magnetic field generated by the dicingmachine, the die bonding machine, and the wire bonding machine.Therefore, special machines prepared for preventing external magneticfield are not required as these manufacturing machines, and ordinarymanufacturing machines can be used. However, it is effective for theback grinding machine to employ measures for preventing externalmagnetic field.

In electric-field plating, the effect of external magnetic fieldespecially causes a problem, since an NiFe plate 16 has been previouslyadhered to the MRAM chip 12, the MRAM chip 12 can be protected fromexternal magnetic field. However, the use of a lead frame wherein aplating film has been previously formed is more preferable becauseelectric-field plating after resin molding becomes unnecessary.

In the above example, although the case of a QFP (Quad Flat Package)type package has been described, the first embodiment is not limitedthereto, but can also be applied to a BGA (Ball Grid Array) type packageas shown in FIG. 15. In this case, the MRAM chip 12 to which the NiFeplate 16 is adhered is mounted on the wiring substrate 26. Then, solderballs 27 are formed on the under face of the wiring substrate 26.

Although the case wherein the thickness of the NiFe plate 16 is 100 μmhas been described, the first embodiment is not limited thereto, but ifthe thickness of the NiFe plate 16 is 50 μm or more, the MRAM chip 12can be protected from external magnetic field. However, the thickness ofthe NiFe plate 16 is preferably 100 μm or more. If such a thick NiFeplate 16 is formed on the wafer 11 in the preceding step, there is aproblem wherein the wafer 11 warps due to the stress. However, in thefirst embodiment, since the NiFe plate 16 separately formed in thesubsequent step is adhered on the wafer 11 after forming the MRAM chip12, such a problem can be reduced as much as possible.

It is also preferable that the thickness of the die attach film 17 is 10μm or more. Thereby, the stress generated by the difference incoefficient of thermal expansion between the MRAM chip 12 and the NiFeplate 16 is relieved by the die attach film 17. On the other hand, it ispreferable that the thickness of the die attach film 17 is 40 μm orless. Thereby, since the distance between the MRAM chip 12 and the NiFeplate 16 is shortened, the shielding effect against external magneticfield is enhanced.

In order to relieve stress due to the difference in the coefficient ofthermal expansion, a dummy silicon chip may be provided between the NiFeplate 16 and the MRAM chip 12. Alternatively, another semiconductor chipmay be connected as a flip-chip on the MRAM chip 12. Alternatively,instead of the NiFe plate 16, a material, such as base Si subjected totreatment against disturbance magnetic field, may be joined as the SOI.Furthermore, in order to protect written information, it is preferablethat the step after writing programs and rescue information in the MRAMchip 12 is a low-temperature process of 300° C. or lower. However, it ismore preferable that the temperature is not higher than the processtemperature for magnetic field annealing.

Alternatively, the NiFe plate 16 may be adhered on the surface of theMRAM chip 12. In this case, the die attach film 15 and the NiFe plate 16must be adhered avoiding wire bonding pads by forming openings on thelocations of the wire bonding pads on the surface of the MRAM chip 12,or by lengthening in a plate shape. However, an adhesive strength isrequired to the extent that the die attach film 17 is not peeled off bythe water pressure or the like in the subsequent dicing step.

Second Embodiment

A method for manufacturing a magnetic memory chip device according tothe second embodiment of the present invention will be describedreferring to the flow chart shown in FIG. 16. First, steps to Step S5are conducted in the same manner as in the first embodiment. Next, asshown in FIG. 17, the wafer 11 is adhered to the die attach film 31, andthe wafer 11 is diced to respective MRAM chips 12 using a dicing blade18 (Step S7). Thereafter, cleaning is performed.

Next, as shown in FIG. 18, an NiFe plate 16 is adhered to a die attachfilm 32 to singulate the plate. Then, the singulated NiFe plate 16 isadhered on the individual MRAM chip 12 of the diced wafer 11 via the dieattach film 32 using a die bonding head 33 (Step S13). At this time, asshown in FIG. 19, the NiFe plate 16 is made not to contact the wirebonding pad 34 of the MRAM chip 12.

Next, as shown in FIG. 20, each of the laminated MRAM chip 12 and NiFeplate 16 is picked up by a die-bond pick-up collet 35 and die-bonded onthe lead frame or the wiring substrate via the die attach film 31 (StepS8). The die attach films 31 and 32 are cured by heating to 150° C.

Thereafter, in the same manner as in the first embodiment, steps ofSteps S9 to S12 are conducted. The NiFe plate may be adhered in advanceon the lead frame or the wiring substrate, and a MRAM chip, on which anNiFe plate is adhered, is adhered thereon to be a sandwich structure.

As described above, in the second embodiment, an NiFe plate 16 formed ofa substance having a higher magnetic permeability than silicon isadhered to the back face of the wafer 11 in the middle of the assemblystep. Thereby, in the subsequent assembly step, the MRAM chip 12 can beprotected from external magnetic field. Specifically, the MRAM can beprotected from external magnetic field generated by the die bondingmachine and the wire bonding machine. Therefore, special machinesprepared for preventing external magnetic field are not required asthese manufacturing machines, and ordinary manufacturing machines can beused. However, the countermeasure to prevent external magnetic field isrequired for the back grinding machine, the dicing machine, and the diebonding machine for adhering the singulated NiFe plate on the wafer.

Third Embodiment

A method for manufacturing a magnetic memory chip device according tothe third embodiment of the present invention will be describedreferring to the flow chart shown in FIG. 21. First, steps to Step S5are conducted in the same manner as in the first embodiment. Next, thewafer 11 is diced to respective MRAM chips 12 (Step S7), and as shown inFIG. 22, the MRAM chip 12 is die-bonded on the wiring substrate 26 (StepS8). The MRAM chip 12 may be die-bonded on the lead frame.

Next, as shown in FIG. 23, the singulated NiFe plate 16 is adhered oneach MRAM chip 12 (Step S14). At this time, the NiFe plate 16 is madenot to contact the wire bonding pad of the MRAM chip 12. Thereafter, inthe same manner as in the first embodiment, steps of Steps S9 to S12 areconducted. The NiFe plate may be adhered in advance on the lead frame orthe wiring substrate, and a MRAM chip, on which an NiFe plate isadhered, is adhered thereon to be a sandwich structure.

As described above, in the third embodiment, an NiFe plate 16 formed ofa substance having a higher magnetic permeability than silicon isadhered to the back face of the wafer 11 in the middle of the assemblystep. Thereby, in the subsequent assembly step, the MRAM chip 12 can beprotected from external magnetic field. Specifically, the MRAM can beprotected from the external magnetic field generated from the wirebonding machine by spark or the like. Therefore, special machinesprepared for preventing external magnetic field are not required as thewire bonding machines, and ordinary manufacturing machines can be used.However, the countermeasure to prevent external magnetic field isrequired for the back grinding machine, the dicing machine, and the diebonding machine.

INDUSTRIAL APPLICABILITY

According to the embodiments, the magnetic memory chip can be protectedfrom external magnetic field in the assembly step. Thereby, even whenordinary manufacturing equipment is used, the magnetic memory chip canbe protected from external magnetic field generated from suchmanufacturing equipment. Therefore, the advantage wherein no change inthe assembly line is required can be obtained.

1-8. (canceled)
 9. A method of manufacturing a semiconductor devicecomprising the steps of: preparing a silicon wafer having a plurality ofmagnetic memory chips, the silicon wafer having a predeterminedthickness; writing information in each of the plurality of magneticmemory chips of the silicon wafer; after the step of writinginformation, back-grinding the silicon wafer to reduce the predeterminedthickness of the silicon wafer; after the step of back-grinding, dicingthe silicon wafer into respective magnetic memory chips each having thereduced thickness by the back-grinding; after the step of dicing,mounting one of the respective magnetic memory chips on a substratethrough a high magnetic permeability plate, the high magneticpermeability plate having a higher magnetic permeability than siliconand being disposed between a back surface of the one of the respectivemagnetic memory chips and the substrate.
 10. A method of manufacturing asemiconductor device according to claim 9, wherein the high magneticpermeability plate is adhered to the back surface of the one of therespective magnetic memory chips, after the step of back-grinding andbefore the step of dicing of the silicon wafer.
 11. A method ofmanufacturing a semiconductor device according to claim 9, wherein thesubstrate is a die pad for supporting the one of the respective magneticmemory chips, and wherein the method further includes a step ofpreparing a lead frame member having the die pad and a plurality ofleads disposed to surround the die pad, and wherein the one of therespective magnetic memory chips is adhered to the die pad via a dieattaching film.
 12. A method of manufacturing a semiconductor deviceaccording to claim 9, wherein the substrate is a wiring substrate forsupporting the one of the respective magnetic memory chips.
 13. A methodof manufacturing a semiconductor device according to claim 11, furtherincluding a step of electrically connecting the plurality of leads andelectrodes of the one of the respective magnetic memory chips by aplurality of bonding wires respectively, and a step of sealing the oneof the respective magnetic memory chips, the die pad, the high magneticpermeability plate, portions of the plurality of leads, and theplurality of bonding wires by a resin member.